The Integrated Circuit (IC) is the heart of any electronic device. Without it, there would be no computers, smartphones, or even smart appliances. But what is an IC, exactly? An IC is basically the size of a postage stamp, and has many tiny electronic components etched onto it. These components are the “brain” of the device, and if it doesn’t have an IC, then it is not an electronic device.
The industry standard for packaging electronics is to use ceramic interconnects, thus the abbreviation IC. These interconnects can come in a number of flavors, including metal, PLCC, QFP, and a few others. The package options depend on a number of factors that include cost, space, functionality, and the environment, among others.
The first integrated circuit was invented by Jack Kilby who was a scientist at Texas Instruments in the 1950s. Kilby fabricated his first IC out of germanium. However, his boss was not happy because he could not immediately see how it was going to be used. After the successful creation of the first IC, many other people tried to make ICs. Some of them were successful. The Integrated Circuit (IC) is the most sophistated component that exists in all electronic devices. Most of the circuits in the devices are fabricated using the ICs. The size, shape, and material of the ICs changes with time. The ICs are very important for the growth of the electronic devices.
DIP (Double In-line Package)
The package to the right is the Double in-line package. These two package types are found in many different semiconductor processes, including high speed interconnects used in the microprocessor, RF circuits for cellular, and other integrated circuits. The key to these packages is that they are double in-line, or stacked in-line. This is because the single wires in the wire wrap do not fill the package completely, leaving space for the package to be filled. The advantage of this approach is that the space can be used for other purposes, such as attaching the package to the substrate.
Small Outline Package
The Small Outline Package (SOP) is a new package design for electronic systems. The SOP package was designed for easy and reliable circuit patterning. The patterning of the SOP package was inspired by the streamlined shapes of aircraft and rockets, and the high performance of small rockets and jets. The SOP package can be fabricated in a wide range of materials and forms and is well suited to high volume, low cost manufacturing.